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VIEW EVENTS CALENDAR....
APRIL 2018 EVENT
LA/OC SMTA is Proud to Present an Educational and Networking Event...

Chapter Dinner Meeting

Solder Joint Reliability
of
Resin Reinforced Low Temperature Solder Paste


SPEAKER
Andy Behr
Technology Manager
Panasonic Electronic Materials Division


SPEAKER PROFILE
Andy Behr is a Technology Manager with Panasonic Electronic Materials Division. He leads a Cupertino based research and marketing team that develops new materials for electronics and other emerging applications. A significant portion of his role is technology and business scouting which involves "triangulating" strategic level market demands, business drivers and technology advancements to direct enabling materials development. Andy holds a bachelor degree in biology and a master's degree in business. He has more than twenty-five years of experience in material technologies such as photo resists, adhesives, encapsulants, conductive materials, fluoro-chemicals, abrasives, films and tapes. Andy began his career in research and has subsequently held positions in marketing and leadership.

PRESENTATION ABSTRACT
The SAC305 (96.5% tin, 3% silver, and 0.5% copper) solder paste that is commonly used in SMT assembly has a peak reflow temperature that is typically in 240 - 260 ?C range. Many electronic devices, like smartphones, notebook PCs, and tablets are becoming thinner. As they do, packaging substrates, such as ultra-thin flip chip ball grid arrays (FCBAs), and the printed circuit boards (PCBs) on which they are mounted are also becoming thinner. The implementation of progressively thinner substrates is creating manufacturing and reliability challenges. For example, it is increasingly difficult to adequately control the warpage of high I/O CPU packages in notebook PCs during the solder reflow process. This results in a greater numbers of solder joint defects, including Non-Wet Open (NWO) and Head-on-Pillow (HOP) defects resulting from the warpage of package substrates and PCBs.
These issues have created a demand for low-temperature solder pastes to help reduce warpage and improve SMT assembly yields. Tin-bismuth (SnBi) eutectic solders are emerging as viable candidates because they have a desirably low melting point of 139 ?C. However, inteconnects formed with SnBi solder tend to be brittle and are not as reliable as those made with SAC305. Post-reflow reinforcement with polymer underfills can improve the performance of the solder joints, but the additional materials and processes increase manufacturing costs. These issues have somewhat limited commercial adoption of SnBi solder pastes.
This situation prompted Panasonic to develop a solder paste material that combines specialized epoxy resins and other organic components with SnBi solder particles to form a low temperature joint reinforced solder paste or JRP. This approach enables the concurrent formation of SiBn solder joints and a reinforcing polymer collar via a one pass reflow process. This presentation describes the solder joint properties and reliability of the initial material developed by us, as well as the characteristics of an iterative formulation designed to improve reworkability and paste stability.
Our evaluations revealed that the JRP technology alleviates issues the associated with the brittleness of SnBi solder by encasing the weakest region of the solder joints in a fully cured epoxy resin. Ball joint shear testing, BGA solder joint strength testing, temperature cycle testing, and drop shock testing revealed that low temperature JRP solder paste demonstrated equivalent or better joint properties than those made with SAC305 solder paste.


DATE
Thursday, April 19th, 2018
(3rd Thursday of the Month)

AGENDA
6:00PM, Social Hour
7:00PM, Dinner/Presentation

COST
Cash or Check
$20, Members
$35, Nonmembers


Paypal Payment
(Fee + 2.9% + .30 Processing Fee)

$20.88, Members
$37, Nonmembers

MENU
Includes Non-Alcholic Beverages

LOCATION
JT Schmid's Restaurant & Brewery

2610 E. Katella Avenue
Anaheim, California 92806
714.634.9200
http://www.jtschmids.com/

Driving Directions

RESERVATIONS
To Make a Reservation Please Click on Reservation Link Below
Reservation
If you can not attend, please cancel your reservation by 12 Noon the day prior to the event.
Hope to see you there!

MAY 2018 EVENT

LA/OC SMTA is Proud to Present an
Educational and Networking Event...


Chapter Dinner Meeting
&
Member Appreciation Night

SOLDER PASTE QUALIFICATION TESTING

SPEAKER
Doug Dixon

Global Marketing Director
Henkel Electronic Materials, Inc.


SPEAKER PROFILE
Dixon holds an Engineering degree from the University of Utah and, in his current role with Henkel, is based in the company’s Irvine, California facility.
Douglass Dixon is the Global Marketing Director for Henkel Adhesive Technologies, Electronics group. Dixon is responsible for managing Henkel's marketing intelligence, commercial product launch, and marketing communications for the electronics business unit. With over 28 years of electronics industry experience, Dixon has a broad skill set that includes engineering, field service, applications, product management and marketing communications expertise. Since joining Henkel in 2001, Dixon's role has centered on strategic communications initiatives that have significantly raised the company's profile within the global electronics market. During his tenure at Henkel, Dixon has also championed multiple service initiatives on behalf of the company that have made a positive impact on the communities in which Henkel Electronic Materials employees live and work. Examples include Henkel's work with Think Together, a California-based organization dedicated to encouraging children to stay in school; and the Tianhua Orphan Education Project, a Chinese charity that provides full educational assistance for orphaned children.

Dixon holds an Engineering degree from the University of Utah and, in his current role with Henkel, is based in the company's Irvine, California facility.

PRESENTATION ABSTRACT
Is it time to upgrade your solder paste?
Many SMT operations struggle with "process issues" that are actually solder paste-related, and have been resolved in newer generations of the materials. Nagging defects like tombstones, solder balls, excessive voids and Head-In-Pillow can often be mitigated with a change of solder paste. Newer formulations print better, wet better, endure hot reflow cycles better, and void less than older ones.

In the world of solder pastes, one size does not fit all, which is why there are so many variants to choose from. The myriad of options can be overwhelming, and matching the right product to any given operation can be confusing, time consuming and costly:

F Solder paste has many conflicting properties - one that prints well may not pin test well, or one that minimizes voiding may reflow well, and tradeoffs must be considered
F Developing test methods takes a great deal of engineering time and experience
F Executing the tests requires engineering and production line time
F Production boards are expensive test vehicles and may not test every property
F Laboratory test boards often require a lot of manual setup and may not test every property, requiring multiple boards, setups and test runs

When a small EMS provider determined it was time to update the SMT process chemistry, they needed to develop a test program that they could execute efficiently while keeping production running and costs under control. When a solder paste provider wanted to commercialize their laboratory test board and needed a beta site, a working partnership was formed. The cooperative effort produced a consolidated test plan that gauges key solder paste properties, requires less than one shift of line time per product evaluated, and is available as a customizable, off-the-shelf kit.

This presentatin reviews the initial test plan, data collection and analysis processes, and presents the results of the original study. It discusses some of the issues encountered during test development and their resolutions or workarounds. It then interprets the findings using a scorecard method that helps the user weigh the importance of individual solder paste performance characteristics to their operation.

Process details to turn the laboratory board that was beta tested into a production line-ready kit, based off the beta builds, include:

F Updates to the PCB layout to improve sample sizes, embed DOEs and reduce cost
F Full documentation on the PCB including placement and ODB++ files with included BOM for easy programming
F An assembly configurator that calculates sample sizes and component costs as the user inputs the number of PCBs they want to print and populate
F Stencil and PCB support designs
F Step-by-step instructions on how to execute a test that evaluates 20+ solder paste properties in 30 prints and 4 hours of line time
F The score card that enables the assembler to customize their selection criteria for their operation, understand the potential tradeoffs, and make a data-driven decision on their next process chemistry

Additional up-to-date information on the kit, such as availability and the status of the statistical reduction methods will also be provided, as the development work continues.

DATE
Thursday, May 17th, 2018
(3rd Thursday of the Month)

AGENDA
6:00PM, Social Hour
7:00PM, Dinner/Presentation

Cash or Check
$20, Members
$35, Nonmembers


Paypal Payment
(Fee + 2.9% + .30 Processing Fee)

$20.88, Members
$37, Nonmembers


MENU
Includes Non-Alcholic Beverages

LOCATION
JT Schmid's Restaurant & Brewery

2610 E. Katella Avenue
Anaheim, California 92806
714.634.9200
http://www.jtschmids.com/

Driving Directions

RESERVATIONS
To Make a Reservation Please Click on Reservation Link Below
Reservation
Walk-Ins are welcome.
Reservation cancelation is appreciated.
No refunds for pre-paid ‘no-shows’.
Substitute attendee for pre-paid is acceptable.
Hope to see you there!

JUNE 2018 EVENT

LA/OC SMTA is Proud to Present an Educational and Networking Event...

2018 Corporate Member Appreciation Breakfast


iPhone X - Steve Jobs' iPhone

SPEAKER
Dr. Bill Cardoso

CEO
Creative Electron, Inc.


SPEAKER PROFILE
Bill started his first company in Brazil at age 17 and sold it a few years later when invited by the US Department of Energy to work at Fermi National Accelerator Laboratory to do nuclear and high energy physics research. As the Department Head for Systems Engineering and after a 10-year long career at Fermilab, Bill moved from Chicago to sunny California to start Creative Electron. True to the American Dream, Creative Electron quickly grew from Bill's garage to the largest US manufacturer of x-ray machines for the electronics industry (no longer in his garage). At Creative Electron Bill leads the team of engineers who designs and manufactures x-ray systems that are shipped worldwide. Starting with an associate's degree at age 13, Bill has a BS, MS, and PhD degrees in Electrical and Computer Engineering and an MBA from The University of Chicago. Bill is the president of the SMTA San Diego chapter and member of the technical committee for SMTA International, SMTA Counterfeit Conference, and SMTA LED Conference, Components for Military and Space Electronics Conference, SPIE Photonics, and the IEEE Nuclear Science Symposium. He is an IEEE Senior member and the author of over 150 technical publications, author of 2 books, owner of a few patents, and a frequent speaker at technical conferences.

PRESENTATION ABSTRACT
It's been 10 years since Steve Jobs introduced the iPhone to the world. Much has happened since then. Over this past decade, the iPhone became a reference design, and the object of desire of a legion of fans who wait anxiously for every launch of the Cupertino company. Undoubtedly the most advanced iPhone in the market today, the iPhone X is a technology marvel. The double stacked boards, dual battery, and a face recognition sensor bring the iPhone X to a whole different level.
In this presentation, we'll explore these technological advances by a live teardown of the iPhone X. The teardown will be followed by a detailed coverage of the technical details of critical parts of the device. This live teardown will be accompanied by x-ray and CT images of the iPhone X, so the audience will get unprecedented insights on what makes this iPhone tick. More importantly, we will explore the assembly process utilized to put the iPhone X together. This presentation is targeted at a wide technical audience looking for a better understanding on how advance consumer electronics are designed and assembled.



DATE
Thursday, June 21st, 2018
(3rd Thursday of the Month)

AGENDA
10am, Meet & Greet
10:20am, Breakfast
11:00am, Presentation
11:30am, Chapter Announcements

COST
Cash or Check
$0, 1st Corporate Member
$10, Each Add’l Corp Member
$10, Member
$20, Non-Members

Paypal Payment
(Fee + 2.9% + .30 Processing Fee)

$10.60, Add’l Corp Member & Members
$20.90, Nonmembers
$20, Non-Members

Event Flyer

MENU
Catered by Sandor's Gourmet Catering, Inc.

Breakfast
Scrambled Eggs
Served with Bacon & Sausage,
Home Fried Potatoes & Salsa on the Side
Assorted Breakfast Breads, Sliced Fruit
Assorted Juices, Reg. Coffee & Decaf

LOCATION
Paradigm Contract Manufacturing LLC
11562 Knott Street, Unit 13-14
Garden Grove, CA, 92841-1823
PH - 714-889-7074
FAX - 714-893-1801
http://www.pcm-cm.com/

SEPTEMBER 2018 EVENT
LA/OC SMTA is Proud to Present an Educational and Networking Event...

Chapter Dinner Meeting



SPEAKER


SPEAKER PROFILE


PRESENTATION ABSTRACT



DATE
Thursday, September 20th, 2018
(3rd Thursday of the Month)

AGENDA
6:00PM, Social Hour
7:00PM, Dinner/Presentation

COST
Cash or Check
$20, Members
$35, Nonmembers


Paypal Payment
(Fee + 2.9% + .30 Processing Fee)

$20.88, Members
$37, Nonmembers


MENU
Includes Non-Alcholic Beverages

LOCATION
JT Schmid's Restaurant & Brewery

2610 E. Katella Avenue
Anaheim, California 92806
714.634.9200
http://www.jtschmids.com/

Driving Directions

RESERVATIONS
To Make a Reservation Please Click on Reservation Link Below
Reservation
If you can not attend, please cancel your reservation by 12 Noon the day prior to the event.
Hope to see you there!

NOVEMBER 2018 EVENT
LA/OC SMTA is Proud to Present 2018
8th Annual Expo & Tech Forum

ATTENDEE COST
FREE FREE FREE
Free Lunch!
Free Technical Sessions!
Free Parking!
Free Raffle!

4 $25 gift cards will be Raffled every hour
+ 2:30pm Exhibit Floor Raffle


DATE
Thursday, November 1st, 2018
(1st Thursday of the Month)

LOCATION
The Grand
4101 E. Willow St.,
Long Beach, CA 90815
T. 562.685.8198
http://thegrandlb.com/

Driving Directions


Event Flyer

Agenda
Show Hours
10am to 3pm

View 2017 Tech Expo Vendor



Technical Session 1
11am to 11:30am
Material Management 4.0

Speaker
Dr. Bill Cardoso

CEO
Creative Electron, Inc.


Speaker Profile
Bill started his first company in Brazil at age 17 and sold it a few years later when invited by the US Department of Energy to work at Fermi National Accelerator Laboratory to do nuclear and high energy physics research. As the Department Head for Systems Engineering and after a 10-year long career at Fermilab, Bill moved from Chicago to sunny California to start Creative Electron. True to the American Dream, Creative Electron quickly grew from Bill's garage to the largest US manufacturer of x-ray machines for the electronics industry (no longer in his garage). At Creative Electron Bill leads the team of engineers who designs and manufactures x-ray systems that are shipped worldwide. Starting with an associate's degree at age 13, Bill has a BS, MS, and PhD degrees in Electrical and Computer Engineering and an MBA from The University of Chicago. Bill is the president of the SMTA San Diego chapter and member of the technical committee for SMTA International, SMTA Counterfeit Conference, and SMTA LED Conference, Components for Military and Space Electronics Conference, SPIE Photonics, and the IEEE Nuclear Science Symposium. He is an IEEE Senior member and the author of over 150 technical publications, author of 2 books, owner of a few patents, and a frequent speaker at technical conferences.

Presentation Abstract
Over the past years the electronic assembly industry has focused on the development of Industry 4.0, a standard communication protocol that allows production equipment to dialogue. This communication protocol will be a key enabler to improve the quality and efficiency of the production line. This is achieved by creating a feedback loop between inspection and production - thus allowing problems to be identified and corrected as early as possible in the manufacturing line. As a result, the overall cost of manufacturing is reduced as yield rates increase.
Despite the great progress in the development of the integrated production line, a critical part of the manufacturing chain remains offline. Inventory rooms around the world still must operate with a far reduced level of sophisticated. It is not uncommon to find thousands of reels densely packed in hundreds of linear feet of shelving space. The simple exercise of counting back reels as they come back from the production floor is not standard practice. And even when they are counted, the count is often made by hand. The lack of focus on the automation of our inventory rooms leads to an increasing loss of productivity due to line stoppages. When associated with the recent increase in lead times for electronic components, line stoppage has become a crippling problem that makes inventory accuracy a necessity.
In this presentation, we'll introduce Material Management 4.0. More than a set communication protocol between machines that count electronic parts and the machines that store them. From x-ray parts counters to fully automated and intelligent storage towers, Material Management 4.0 embraces the overall infrastructure that needs to be in place to realize an accurate, fast, and efficient methodology for inventory control. This investment is critical to realize the benefits in efficiency unleashed by Industry 4.0.



Lunch
Free for All

11:45am to 12:45pm


Technical Session 2
1:00pm to 1:30pm


Speaker


Speaker Profile

Presentation Abstract


Technical Session 3
2pm to 2:30pm


Speaker


Speaker Profile



Presentation Abstract



Exhibit Floor Raffle
Throughout the Day
Special Thanks to our Raffle Sponsors


Exhibitor COST
Corporate Members = $375/$475 (early/late)
Click here for Membership Information
Non-Corporate Member = $450/$550 (early/late)


Exhibit package includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 5th, 2018!

Floor Layout Diagram
2017 Table Locations

 
DECEMBER 2018 EVENT
LA/OC SMTA 2018
Annual Holiday Party


Dave & Buster's


DATE

Friday, December 7th
, 2018
(1st Friday of the Month)

AGENDA
6:00PM, Social Hour
7:00PM, Dinnner

7:45pm, Entertainment

COST
Cash or Check
$20, Members
$35, Nonmembers


Paypal Payment
(Fee + 2.9% + .30 Processing Fee)

$20.90, Members
$37, Nonmembers

MENU
Full Menu

LOCATION
Dave & Busters
661 Spectrum Center Dr
Irvine, CA 92618
949.727.0555

https://www.daveandbusters.com/irvine

Driving Directions
 
2017 GOLF EVENT HAS BEEN CANCELED DUE TO POOR PARTICIPATION
Comments regarding event cancelation can be sent to any board member through our contact page
 
A BIG THANKS TO ALL OUR
2016
GOLF SPONSORS!


WE COULD NOT HAVE DONE IT WITHOUT YOUR SUPPORT!!!!!!!

Please take a second and...
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© 2001 LA/OC SMTA Chapter